io-2000 series pads are fiber based and resin treated (polyurethane) with a nominal finished thickness ranging from 0.05 inches to 1 inch. io-2000 series are designed to accommodate diverse polishing applications and surfaces. The fiber material makes excellent interconnecting cellular structures which makes the pad highly durable and dimensionally stable. A wetted pad can expand up to 10% in thickness while maintaining its surface uniformity and parallelism.
io-2000 series polishing pads are designed to have controlled density and hardness ranging from A Scale 70 up to A Scale 90+. These pads are designed to provide rapid stock removal while achieving superb surface finishes. Recommended for use on most abrasive types such as diamond, aluminum oxide, colloidal silica, silicon carbide and cerium oxide.
Recommended for polishing both hard and soft materials:
- silicon wafers
- cadmium telluride
- gallium arsenide